History
June 1967 |
Hi-Silicon Co., Ltd. established jointly by Japan Electronic Metals Co., Ltd. and Osaka Titanium Co., Ltd. |
April 1968 |
Commenced manufacture of polycrystalline silicon and chlorosilane products in Yokkaichi City, Mie Prefecture |
January 1979 | Japan Electronic Metals Co., Ltd. transferred business operations of the Silicon Manufacturing Division to Japan Silicon Co., Ltd. (later Mitsubishi Materials Silicon Corporation and current SUMCO Corporation) |
March 1985 | Equity interest of Japan Silicon Co., Ltd. was transferred to the parent company Mitsubishi Metal Corporation |
October 1987 | Osaka Titanium Co., Ltd. withdrew its shares, making the company a wholly owned subsidiary of Mitsubishi Metal Corporation |
December 1990 | Mitsubishi Metal Corporation merged with Mitsubishi Mining & Cement Co., Ltd. to form Mitsubishi Materials Corporation |
July 1996 | Established Mitsubishi Polycrystalline Silicon America Corporation (current High-Purity Silicon America Corporation) |
January 1997 | Built Suzuka Finishing Plant for the final shipment process in Suzuka City, Mie Prefecture |
June 1997 | Company name changed from Hi-Silicon Co., Ltd. to Mitsubishi Materials Polycrystalline Silicon Corporation |
April 2007 | Mitsubishi Materials Yokkaichi Plant launched through absorption-type merger by Mitsubishi Materials Corporation |
November 2010 | The 2nd Plant constructed on site adjacent to existing plant in Yokkaichi City, Mie Prefecture |
April 2023 | High-Purity Silicon Corporation, a Group company of SUMCO Corporation, formed through a business transfer by Mitsubishi Materials Corporation |